Language: EN | 中文 |

QUICK 7610

Features:

Open dark infrared heating, no nozzles required, low costs of use.
The non-contact infrared sensor monitors the BGA temperature real-timely, and the desoldering is under control.
Intelligent and highly automated, computer controlled.
Easy to learn; successful soldering only takes 10 minutes of operation.

Specifications:
 
General Power 2400 W (Max.)
Power Supply 220 V AC 50 Hz
Top Hot Air Heating Power 720 W
Bottom Preheating Power 400 W * 4 = 1600 W (infrared heating plate)
Bottom Radiation Preheating Size 260 mm * 260 mm
Max. Circuit Board Size 420 mm * 400 mm
Communication Standard RS-232 C (connected with PC)
USB Port Output 5V DC, 1A, connected to USB lighting equipment
Infrared Temperature Sensor 0 - 300 ℃
Weight About 54 kg
Overall Dimensions (L*W*H) 800 * 580 * 520 mm


 Inquiry - QUICK 7610